System performance & benefits
The operation of DiAMon Plus™ dielectric cure monitoring system is the result of leading edge research effort within INASCO over the last 12 years and is now patented.

The key element of the DiAMon Plus™ system is the dielectric sensor , which allows the application of the system to a wide range of manufacturing processes. The system performs well in industrial environment due to its robust hardware modules and the carbon proof enclosure which protects the electronics from exposure to hazardous material. Also the robustness of the sensor is high for all industrial applications considered so far.

As becomes clear from the laboratory scale and industrial installations of the system in composites processing, there are several benefits of the system use. The most significant benefits are the reduction of the cure cycle and the quality assurance of the produced components.

The first benefit comes from the elimination of the safety margins in the recommended cure cycle (issued by the raw materials manufacturers) as the real end-of-cure point is detected by the in-process sensor. 


The cure cycle savings amount up to 30% of the total time (including the cooling stage),
which results to significant energy savings and increased utilisation of the manufacturing tools. 

The second benefit arises as a result of the monitoring signature provided by the sensing system, as there is a certifying ‘signature’ that the materials have undergone the main process milestones (maximum flow, gelation, end-of-cure) at times within an acceptable range (statistical process control). The compliance with a prescribed path in processing is crucial for the manufacturing of complex and integrated composites parts, which is a current trend in aerospace sector.

Additional benefits from the use of our system in composites manufacturing include the reduction of scrap (resulting from the continuous monitoring of the material state) and the determination of the ‘as produced’ material properties of the resin system (which can lead to reduction of post-processing testing of parts).