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Dielectric Cure Monitoring technology
Dielectric Cure Monitoring research efforts include various adaptations of the developed process monitoring and control system for composite materials manufacturing. INASCO is leading European Consortia in the projects CondiComp (FP5), COMPROME and SENARIO (FP6) and has developed dedicated hardware, software and algorithms for the cure modeling and monitoring in composites processing and adhesive bonding processes, which are commercially available.
 
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Related publications

Maistros, G., Bofilios, D.A., Cracknell, G. and Milburn, A., "Intelligent curing of composites: integration of dielectric cure monitoring with a knowledge-based system for efficient component recovery," Proceedings of the 19th International SAMPE Europe Conference, Paris, France, 22-24 April 1998, M.A. Erath Editor, Published by SAMPE EUROPE, 1998, pp. 733-743.

 

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